Pick & Place Machine, Chip Mounting Machine, SMT Placement Machine
1. A replacement speed of 28,000 CPH has been designed in this pick and place machine by using 6-head placement device.
2. The correcting system assures precise positioning and alignment, leading to reliable mounting.
3. Accurate positioning of workpieces of irregular shapes is ensured by the most up-to-date positioning device.
4. Stable feeding and least possible energy consumption have been assured by the vacuum pump.
5. High-precision and high-speed operation is realized.
|Positioning||Moveable sensor + fixed sensor|
|Placement device||6 heads × 1|
|Placement speed||28,000 CPH|
|Placement precision||Chip/QFP||±50μm＠μ+3σ/Chip, ±30μm＠μ+3σ/QFP|
|Components||Movable sensor||FOV 16 (Optional)||0402(01005 inch)-□14mmIC, Connector( Pin spacing: 0.4mm) BGA, CSP( Distance between solder balls: 0.5mm)|
|FOV 25 (Standard configuration)||0603(0201inch)-□22mmIC, Connector(Pin spacing: 0.5mm) -□17mmBGA, CSP(Distance between solder balls: 0.75mm)|
|Fixed sensor||FOV 35 (Optional)||-□32mmIC, Connector (Pin spacing: 0.3mm) BGA, CSP(Distance between solder balls: 0.5mm) -□55mm(MFOV)|
|FOV 45 (Standard configuration)||-□42mmIC, Connector(Pin spacing: 0.4mm) BGA, CSP(Distance between solder balls: 1.0mm) -□55mm(MFOV), -□75mm connector|
|PCB size||Minimum (L×W)||50mm × 40mm|
|Maximum (L×W)||4460mm× 400mm, 510mm×460mm 610mm×510mm, 740mm× 460mm|
|PCB thickness||0.38-4.2 mm|
|Electricity||Power supply||AC200/208/240/380/415V (50/60Hz, 3Phase)Max.4.7kVA|
|Air pressure||0.5-0.7MPa(5-7kgf/cm2)180NL/min, 50NT/min|
|Dimensions||1,650mm×1, 5680mm×1, 530mm|